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How to achieve higher yields in semiconductor backend applications

Webinar with Plasmatreat
Timeslot 1 (6 am UTC) 02:00 pm CST (Shanghai, China)
Timeslot 2 (12 noon UTC) 02:00 pm CEST (Hamburg, Germany)
Timeslot 3 (3 pm UTC) 11:00 am EDT (Charlotte, NC)
October 22, 2024

How to achieve higher yields in semiconductor backend applications

 

Do you want to find out how Openair-Plasma®  improves wetting and adhesion along the semiconductor backend process chain? And how it can be applied and monitored effectively?

 

Then you should join this free PlasmaTalk in cooperation with KRÜSS hosted by Plasmatreat. Nico Coenen (Plasmatreat) and Dr. Andrew Mellor (KRÜSS) combine their expertise in plasma treatment and surface analysis.

 

Openair-Plasma® and its application in backend steps

Nico Coenen (Plasmatreat) will explain the significant benefits the innovative plasma technology brings to backend process steps, particularly for surface cleaning, surface preparation, and component encapsulation.

 

Topics

 

  • Comprehensive overview of Openair-Plasma® technology
  • Optimizing surface properties to improve yield in semiconductor processes
  • The role of contact angle measurement
  • Underfill steps: enhancing flow and spreading
  • Molding: improving adhesion and long-term stability
  • Case studies and real-world applications

 

Nico Coenen is the Global Business Development Manager for the Electronics Market within Plasmatreat. With over 25 years of experience in the electronics market he has visited numerous factories all over the world. Working in a global role for companies like Nordson and Mycronic has given him a very broad spectrum of what is happening within the PCBA and semiconductor market.

 

Optimizing and monitoring Openair-Plasma® via contact angle

Dr. Andrew Mellor (KRÜSS) explains methods for analyzing wetting and adhesion in different backend steps and presents results obtained in real-life application cases. 

 

Topics

 

  • Checking cleanliness prior wire bonding with micro contact angle measurement
  • Analyzing wetting and wettability of encapsulants for glob-top potting or dam encapsulation
  • Optimizing underfill flow time for supported components on PCBs

 

Dr. Andrew Mellor obtained an engineering doctorate in surface and interfacial physics/chemistry from the London Centre for Nanotechnology (UCL). At KRÜSS, he serves as an Application Market Manager to our worldwide customer network. In close contact with R&D departments in various industries, he scientifically advises customers in complex surface optimization issues.

 

 

 

 

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